From November 10 to November 13, 2026
Hall B3, Booth 303, Messe München.
Join us to experience how we’re shaping the future of technology.
Lead-free connectivity: the future is compliant
Built on the proven B Series platform, these new solutions provide full Form-Fit-Function compatibility, enabling a seamless transition with no redesign or disruption to existing systems. Customers benefit from the same renowned LEMO quality, precision, and durability while reducing exposure to future regulatory and supply chain risks.
At Electronica 2026, LEMO will showcase its new ORIGINALS B Series Lead-Free solutions, demonstrating how customers can prepare today for tomorrow’s regulatory requirements while maintaining complete confidence in product performance and continuity.
High-Speed data transmission: the future is now
LEMO is at the forefront of this evolution, continuously expanding its portfolio of high-speed interconnect solutions to meet the growing demands of modern applications.
From USB 3.2 and Single Pair Ethernet (SPE) to advanced Cat 8 solutions delivering up to 40 Gbps, LEMO provides robust, high-performance interconnect solutions designed for the most demanding applications.
At Electronica 2026, LEMO will unveil two new solutions: a new encapsulated USB-C connector and an advanced Cat 8 Ethernet solution delivering up to 40 Gbps. Combining exceptional signal integrity, reliability, and ruggedness, these innovations help customers unlock the full potential of next-generation data-driven systems.
Visit the LEMO Booth
Our booth is designed to provide a unique and immersive experience.
Discover the world of LEMO and explore the diverse applications we address. Learn about our best-in-class solutions, engage and exchange ideas with our experts, and take a moment to relax and unwind.
