Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective, low-silver alloys, including SAC105 and SAC0307.
Indium12.9HF is specifically formulated to accommodate fine feature printing, as seen with 01005 components. It offers unprecedented stencil print transfer efficiency, works across a broad range of processes to boost SPI yields, and delivers best-in-class voiding performance, improving thermal management and reliability. In addition, Indium12.9HF demonstrates high oxidation resistance to protect metal surfaces during reflow, ensuring high-quality joints in tough thermal conditions. While specifically structured and optimized for Type 5 powder, its versatility allows it to deliver proven performance with T4 and T6, as well.
“Our R&D team consistently delivers innovative solutions that address the evolving challenges facing the electronics assembly and semiconductor packaging industries,” Tim Twining, Indium Corporation Vice President of Sales, Marketing, and Technical Service, said. “Through close collaboration with our customers, we develop materials and solutions that not only perform under demanding conditions, but also enable the next generation of electronic technologies. Indium Corporation isn’t just creating products—we’re solving meaningful problems and helping our customers bring new innovations to life.”
First presented in 2007, the Circuits Assembly NPI Awards recognize game-changing electronics assembly products introduced during the previous calendar year. Judging is conducted by an independent panel of practicing industry engineers.
To learn more about Indium12.9HF and the full portfolio of Indium Corporation’s next-generation solder technologies, visit www.indium.com.
