DesignCon, the premier annual gathering in the U.S. for chip, board and systems design engineers, returns to the Santa Clara, California, Convention Center from February 24 to February 26, 2026. For over three decades, this flagship Silicon Valley event has served as the essential forum for industry professionals to discover innovative solutions to the most pressing signal and power integrity challenges.
As a global provider of semiconductor test sockets, Smiths Interconnect is proud to announce its participation in this prestigious conference and exhibition. The company will feature a comprehensive portfolio of its star test products, highlighting solutions engineered for the next generation of technology in artificial intelligence (AI) PCs, enterprise data centers (EDC), automotive electronics and the internet of things (IoT).
Spotlight on innovation: DaVinci Gen V high-speed test socket
Headlining the display will be the DaVinci Gen V high-speed test socket, Smiths Interconnect’s latest flagship product. Designed to meet the extreme demands of high-performance computing and AI data centers, the DaVinci Gen V test socket delivers breakthrough high-speed signal transmission and performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications. These speeds are crucial for supporting the growing demand for massive data transfer.
Product features:
· Solution for BGA, LGA and other variants
· Spring probe technology using homogeneous alloy with gold plating for better grounding
· RF bandwidth greater than 84 GHz at -1 dB IL
· Short signal path 4.90 mm test height
· Impedance tuned to match system
· Consistent stable contact resistance 55 mΩ (Average)
· Hi-coplanarity accommodation
· Tri-temp socket design to support -55° C to 150° C
· Designed for manual test, bench test and HVM production test using the same socket
High-power burn-In test socket
Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power discrete component) to a test board for the burn-in and stress testing phase of manufacturing.
Its primary function is to provide a robust, reliable and often automated connection that can withstand extreme conditions far beyond normal operation, specifically:
- To support next-generation devices (up to 22,000 contacts, 150 mm x 150 mm)
- Capable of managing up to 2,000 W of power with integrated liquid cooling
- Universally compatible with all advanced burn-in chamber platforms
- Designed to deliver a 500 lb applied load with a maximum closing force of 15 lb.
- Flexible thermal options including passive heatsinks and heat pipes
This burn-in socket is built for durability and thermal/electrical stability under extreme stress conditions.
Attendees are invited to visit Booth 508 to experience Smiths Interconnect’s cutting-edge technologies firsthand and engage with technical experts.
